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[会议论文] 作者:Thom Kalkman,Paul Seitz,Dave Bennet,Dave Mathy,Tim Tekippe,胡成超,
来源:2011年非开挖技术会议 年份:2011
A号管线是一条内径为96英寸的无压式污水截流管道,它的投入使用将会淘汰康科德城的一个主泵站,而这个泵站目前的旱季平均抽运水量为每天1000万加仑。新管线的修建通过了各......
[会议论文] 作者:Aline Sokol-Cencetti,Dave Wyllie,Yong Yan,
来源:2011中国乳制品工业协会第十七次年会 年份:2011
牛奶的营养如此丰富,能使大量种类的微生物迅速生长繁殖,因此很容易受到污染。为控制牛奶和奶制品的安全性,本文介绍了颇尔公司研究的几种陶瓷微孔过滤技术,该技术有利于帮助......
Swarna bhasma (ancient gold nano particle) – ancient medicine for treatment of connective tissue dis
[会议论文] 作者:S. Agrawal,
来源:国际补充医学研究会第六届年会 年份:2011
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[会议论文] 作者:Fei Xia,Dave Thirumalai,Frauke Gr(a)ter,
来源:第十一届全国量子化学会议 年份:2011
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[会议论文] 作者:S. Si,D. S. Xue,G. P. Zhang,
来源:中国物理学会2011年秋季学术会议 年份:2011
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Computer Modeling of Inductively Coupled Plasmas: Plasma Chemistry and Feature Profile Simulations f
[会议论文] 作者:S. Tinck,A. Bogaerts,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
In this talk,we will explain how to model etching and deposition processes for electronic device fabrication,as applied in Shallow Trench Isolation (STI) and th...
Computer Modeling of Inductively Coupled Plasmas Plasma Chemistry and Feature Profile Simulations fo
[会议论文] 作者:S. Tinck,A. Bogaerts,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
In this talk,we will explain how to model etching and deposition processes for electronic device fabrication,as applied in Shallow Trench Isolation (STI) and th...
[会议论文] 作者:Kunshan Gao,E.Walter Helbling,Donat P.Haeder,Dave Hutchins,
来源:International Conference on Climate Change Science(2011气候变化国 年份:2011
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[会议论文] 作者:Sakai,S. Saito,N. Ninomiya,M.Wakita,S. Mimura,
来源:国际计算/实验科学与工程学术会议(icces2011) 年份:2011
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[会议论文] 作者:Takayama,S. Saito,A. M. Ito,S. Yonemura,H. Nakamura,
来源:国际计算/实验科学与工程学术会议(icces2011) 年份:2011
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The Tribological Properties of Diamond Films According to the Methane Gas Ratio Synthesized by a Mic
[会议论文] 作者:Kim,S. Lee,Y. Jung,W. S. Choi,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
Various techniques such as seeding with diamond particulates,surface scratching,and laser pre-processing,have been applied to enhance the nucleation rate for growing diamond films....
Alternative Splice Variants as a New Class of Protein Cancer Biomarker Candidates in Plasma and Tiss
[会议论文] 作者:Gilbert S. Omenn,Rajasree Menon,
来源:第七届中国蛋白质组学大会暨第三届国际蛋白质组学论坛 年份:2011
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Alternative Splice Variants as a New Class of Protein Cancer Biomarker Candidates in Plasma and Tiss
[会议论文] 作者:Gilbert S. Omenn,Rajasree Menon,
来源:第七届中国蛋白质组学大会暨第三届国际蛋白质组学论坛 年份:2011
Alternative splicing generates protein diversity without increasing genome size,an interesting explanation for the relatively modest number of protein-coding ge...
[会议论文] 作者:S. H. Chen,L. Chen,
来源:中国物理学会2011年秋季学术会议 年份:2011
The linear theory,large signal theory and time-dependent simulation were applied on the study of gyrotron backward wave oscillators (gyro-BWO).The linear analysis,which considers the convective loss d...
The optical and electrical characterization of solarcell devices based on the physical parameters of
[会议论文] 作者:Yoonseog Song,S. O. Ryu,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
Polymer solar cells have been receiving increasing attention for the advantages such as low fabrication cost,light weight,and large size....
Patterning of SnO2 / SnTe binary mask structure for extreme ultra-violet lithography using inductive
[会议论文] 作者:S. J. Lee,J. H. Lee,N.–E. Lee,S. J. Park,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
Currently,extreme ultra-violet lithography (EUVL) is the major candidate of next generation lithography for below 25 nm technology node....
[会议论文] 作者:Huang,S. Y. Hung,Y. S. Liu,Y. Y. Hung,
来源:国际计算/实验科学与工程学术会议(icces2011) 年份:2011
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Low Plasma Induced Damaged Neutral Beam Etching of Metal Gate in Metal Gate/High-k Dielectric CMOSFE
[会议论文] 作者:S. Min,J. S. Oh,C. K. Kim,G. Y. Yeom,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
As the critical dimension (CD) of the metal-oxide-semiconductor field effect transistor (MOSFET) is scaled down to 45nm node and below,the compatibility of the present gate (poly-Si) with high-k diele...
Patterning of SnO2 / SnTe binary mask structure for extreme ultra-violet lithography using inductive
[会议论文] 作者:S. J. Lee,J. H. Lee,N.–E. Lee,S. J. Park,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
Currently,extreme ultra-violet lithography (EUVL) is the major candidate of next generation lithography for below 25 nm technology node....
[会议论文] 作者:S. Oh,K. S. Min,C. K. Kim,G. Y. Yeom,
来源:2011年第三届微电子及等离子体技术国际会议 年份:2011
For the various electronic devices such as microelectromechanical system (MEMS) devices,thin film transistor-liquid crystal display (TFT-LCD) devices,flexible display devices,etc.,dielectric thin film...
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