Sn-base相关论文
Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during agin
The growth of Au-Sn intermetallic compounds(IMCs) is a major concern to the reliability of solder joints in microelectro......
电装行业中对镀金界面采用锡基焊料软钎焊之前进行搪锡去金的标准一直存在争议。采用SEM、体视显微镜等设备对厚膜混合集成电路（HIC......
