Several Cu/Au thin films,which are obtained by different modulation periods and different preparation methods,are performed nanoindentation based on molecular dynamics simulations at different temperatures.The force-depth curves of the loading and unloading process of indentation indicate the temperature has an effect on the hardness of thin films which becomes weak as the temperature increase.The modulation periods and preparation methods have little influence on the hardness.The indenter can cause more complicate defects in thin films obtained by deposition method than that obtained by ideal modeling based on lattice constant.And there are more defects in the thin films with high temperature.