In this work,we proposed a novel method to fabricate a quasi chip processing free light emitting diodes (LED).The multi steps photolithography and etching were considered as main factors that attributed to high cost,long circle LED chip fabrication.Additionally,multi fingers electrode,which commonly used in high power LED chip,were subject to metal shadowing effect and current crowding effect at high injection.However,it is inevitable to adopt multi step photolithography and etching to achieve certain electrode pattern,which is necessary to obtain uniform current injection.