Initially developed in the United States for the military and defense applications, the uncooled infrared focal plane array (UIRFPA) detectors are now widely used in areas of electrical power industry,manufacturing industry, security and surveillance, automotive night-vision etc. due to its small size and low cost. It was projected that the total market value for the uncooled infrared will reach 3.4 billion dollars in 2016. UIRFPA is thus undoubtedly a very important application direction for the MEMS technology. And the market growth has attracted more players to enter this technical section. The UIRFPA is manufactured with semiconductor compatible CMOS-MEMS surface micromachining technology, itsstructure, processing technology, and packaging technology all have unique requirements and features,and it is a typical example to analysis the MEMS application in a commercial product. At the same time, the technology and trends have evolved significantly over the past 5 years, more and more suppliers are moving to foundry service instead of setting-up internal processing lines, which is driving towards lower production cost and open up more commercial applications. At the product level, the array size is increasing and the pixel pitch is continuously decreased. The packaging is moving from the hermetic metal house towards wafer level packaging (WLP).