Due to various benefits such as atomic level thickness control and excellent conformality,atomic layer deposition (ALD) is expected to play an important role in future device fabrication.Especially,plasma enhanced ALD (PE-ALD) allows deposition at significantly lower temperatures with better film properties than conventional thermal ALD.This low temperature process makes PE-ALD more attractive for emerging nanoscale device fabrication.In addition,since ALD is surface-sensitive deposition technique,surface modification by plasma exposure can be used to alter nucleation and adhesion.In this presentation,several examples of PE-ALD processes for various applications such as semiconductor/display devices fabrication will be presented.