DuPont has a deep interest in long-term module reliability in relation to our products for the solar market.We have several thrusts to study the interactions of photovoltaic module component materials and their impact on module durability from a holistic point of view.While the impact of backsheets and encapsulants on module durability has been studied to a great extent by DuPont and many others,the role of metallization pastes is significantly less understood.Understanding metallization reliability is crucial as two-thirds of all defects detected in fielded modules is directly related to cell and metallization.One durability-related aspect of metallization pastes is their adhesion strength to the tabbing ribbons.We have developed methods to control adhesion over a wide range,from 0.3N/mm to 3N/mm,and are among the first to quantify the impact of adhesion on module durability.We present our finding that adhesion does not have a measurable impact on module durability for ultra-low adhesion conditions below 1 N/mm for accelerated testing in accordance with IEC61215 conditions.Additionally,we present the effect of three aged adhesion studies and the effect on metallization reliability.This study presents the first steps in developing relevant accelerated testing of metallization adhesion requirements deemed safe for long term reliability.It simulates the effect on adhesion by baking at three different temperatures and baking duration followed by IEC based thermal cycling.We will show current-voltage results at each stage in the process and correlate with adhesion results.From this we conclude the applicability of this accelerated test towards long term metallization reliability.