Parametric Numerical Study of the Flow and Heat Transfer in Wavy Microchannel with Dimples

来源 :2nd International Workshop on Heat Transfer Advances for Ene | 被引量 : 0次 | 上传用户:jianzi
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  Heat dissipation of micro chips and integrated circuits becomes more and more serious since the density of transistor grows.Microchannel cooling method is most popular.In this paper, a new microchannel cooling method,microchannel heat sink with dimples, is investigated on heat transfer and flow resistance.
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