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The market for LED has been increasing for the past few years.Significant market increment has been observed since the implementation of white LED for the LED-backlit LCD television in 2009.Follow by the high demand of high-efficiency white LED,the necessity of lowering the manufacturing cost but at the same maintaining the brightness efficiency is the current hot topic for the LED industry.Sapphire is the material commonly used for high brightness LED product.This paper is to discuss the latest grinding and dicing solution for sapphire wafer