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随着现代科学技术的不断发展,光学介质薄膜已被广泛地应用于各个部门。它的种类很多,而其特性及用途亦各不相同,即使同一种材料的介质薄膜,由于制备工艺的不同,会引起其特性的变化。例如;牢固性、机械强度、表面及内部结构形态的差异等等。采用电子显微镜有可能为广大科技人员了解到介质薄膜微观结构的变化。对于介质薄膜断面的研究,能较全面地剖析膜层与基片、膜层与膜层之间的结合情况和内部晶粒变化,以及不同烘烤温度和时间对膜层的结合、牢固性和机械强度等影响,从而改进工艺,制备出较为适用和可靠的薄膜。
With the continuous development of modern science and technology, optical media film has been widely used in various departments. Its variety, and its characteristics and uses are also different, even with the same material of the dielectric film, due to the different preparation process, will cause changes in its characteristics. For example; firmness, mechanical strength, differences in surface and internal structure morphology and so on. The use of electron microscopy may be for the majority of scientific and technological personnel to understand the dielectric thin film microstructure changes. For the study of dielectric film cross-section, it can comprehensively analyze the bonding between the film and the substrate, the bonding between the film and the film and the internal grain changes, as well as the combination of the film baking temperature and time, the firmness and Mechanical strength and other effects, thereby improving the process, to prepare a more applicable and reliable film.