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提出了一种新的基于半导体激光的选择性激光烧结快速成型方法。由若干个单独驱动的高功率半导体激光器形成线阵，经过光学准直器，在工作面上形成若干激光短线，并连成与线阵长度相等的激光线束。扫描方式采用导轨Ｘ－Ｙ联动，不存在振镜扫描的“圆弧效应”，因而提高了质量。
A new method of selective laser sintering based on semiconductor laser is proposed. A number of individually driven high-power semiconductor lasers form a linear array, passing through an optical collimator, forming a number of laser short lines on the work surface and connecting them to a laser beam of the same length as the linear array. The scanning mode adopts the guideway X-Y linkage, there is no “arc effect” of galvanometer scanning, thus improving the quality.