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5. Study on bonding interface characteristics and numerical simulation of stress of Aluminum and Glass

Study on bonding interface characteristics and numerical simulation of stress of Aluminum and Glass

来源 :2014中国功能材料科技与产业高层论坛 | 被引量 : 0次 | 上传用户：yuehan3269

【摘 要】

：

Multilayer anodic bonding technology has become one of the key technologies of encapsulation devices of micro electro mechanical systems.

【作 者】

：

Xu Yin Cuirong Liu Yue Nan Qingsen Meng 

【机 构】

：

Tai Yuan University of science and Technology Tai

【出 处】

：

2014中国功能材料科技与产业高层论坛

【发表日期】

：

2014年2期

【关键词】

：

anodic bonding bonding layers residual stress finite element analysis 

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　　Multilayer anodic bonding technology has become one of the key technologies of encapsulation devices of micro electro mechanical systems.

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