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In order to get a good conductivity substrates for foam zinc materials used in zinc-air battery, a novel method for electroless copper plating on microcellular polyurethane foam with diameter of 0.2mm was proposed.A new salt-based palladium colloid activation solution was compared with conventional acid palladium colloid activation solution.The result show that the salt-based palladium colloid activation solution presented fairly high activity, all property parameters of it were better than acid palladium colloid activation solution.The stability of electroless copper plating solution has been studied in this paper.The effects of the components of the solution and the technological conditions on the stability and the sedimentation rate have been analyzed by experiments.The optimal prescription for the solution and the technological regulation for electroless copper plating on polyurethane foam have been determined.