• 不 限
  • 期刊论文
  • 硕博论文
  • 会议论文
  • 报 纸
  • 英文论文
  2. 您的位置
  3. 首页
  4. 会议论文
  5. 270 degree half intensity angle LED retrofit light bulb based on planar light source coupling with r

270 degree half intensity angle LED retrofit light bulb based on planar light source coupling with r

来源 :第十一届中国国际半导体照明论坛 | 被引量 : 0次 | 上传用户：snowtea1987
【摘 要】
：
In this study,an efficient LED retrofit bulb achieved half intensity angle of higher than 270 degree is demonstrated.The new design retained the low cost manufacturability and simultaneously overcome
【出 处】
：
第十一届中国国际半导体照明论坛
【发表日期】
：
2014年1期
下载到本地 , 更方便阅读
下载此文 赞助VIP
声明 : 本文档内容版权归属内容提供方 , 如果您对本文有版权争议 , 可与客服联系进行内容授权或下架
论文部分内容阅读
　　In this study,an efficient LED retrofit bulb achieved half intensity angle of higher than 270 degree is demonstrated.The new design retained the low cost manufacturability and simultaneously overcome the challenging optical requirement.The experimental results indicated that the half intensity angles of the samples were larger than 270 degree and the efficacy is over 75lm/W,which is requested by US energy star.
其他文献
Design for reliability, with an example of a LED PCB layout optimization for a linear product
Many of the reliability work involves extensive testing,finding failure modes,establishing a model for accelerated stress.However,to put a reliable product on the market involves a good product design
会议
LED lightingdesign for reliabilityLED layout
Computational Modeling of Effects of Die Bonding Defect on the Junction Temperature Distribution of
Flip-chip (FC) light-emitting diodes (LED) have been gaining increasing attention in current lighting industry for their prominent thermal performance and excellent light extraction efficiency.For an
会议
Wafer-Level light emitting diode (WL-LED): An innovative approach for cost-effective very high power
A very high power wafer level light emitting diode (WL-LED) has been successfully fabricated on 2 inches InGaN/GaN epi-wafer based on high voltage design.The maximum light output power (LOP) was measu
会议
Factors Influencing the Reflectance of White Epoxy Molding Compound for LED Reflectors
For the poor resistance to heat and light damage as well as the warpage limitation,traditional thermoplastic reflecting material for LED leadframe reflector,such as Polyphthalamide (PPA) and Poly1,4-c
会议
Solution of phosphors in filament LED packing technology
In this article,nitrides phosphors with 1113 structure and YAG yellow green phosphors which could be used to make white light LED at the color rendering index of 80 were discussed.On the one hand,thro
会议
White LEDpackagingphosphorscoatingluminous decay
A flexible module design with LEDs based on Film Assisted Molding technology
Generally using of LED-chips for displaying and lighting is becoming a trend today and also in future.The study focus on the process of assembling LED chips on the polyimide–CCL and molding the flexib
会议
Methods of extrapolation of the LED life time and their comparison based on some LED degradation cur
The degradation of luminous flux of LEDs is dependent on the type of LED and its operation conditions.That is why a prediction of lifetime often differs from case to case.Mostly,the testing times are
会议
The diffusion of Ag in GaN-based Surface Plasmon light-emitting diodes under different temperature a
In order to achieve effective coupling between the surface plasmon and the quantum wells (QWs) for surface plasmon LEDs,metal-embedded or thin p-GaN layer approach have been normally been used,but by
会议
An Overview of Scanning Acoustic Microscope, a Reliable Method for Non-destructive Failure Analysis
In a highly competitive and demanding microelectronics market,reliable non-destructive methods for quality control and failure analysis of electronic components are highly demanded.Any robust non-dest
会议
A new method of calculating the luminance distribution in straight road lighting
The progress of the LED lighting makes the luminance criterion as evaluation standard for road lighting become more important,but the luminance distribution calculation is very difficult.In this paper
会议