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用有限元法建立了铜/钨酸锆缓和热应力功能梯度薄膜的数学模型,讨论了梯度薄膜的层数N,成分分布指数P,梯度层厚度Hf,基片厚度Hm与纯铜层厚度Hc,以及不同工作环境温度θ对薄膜热应力分布的影响。由热力学计算可知:梯度层数越多,缓和热应力效果越好。考虑到制备工艺复杂程度,参考数值模拟结果可知:当N≥5,P=1时,可以减小热应力最大值,热应力最大值出现在基体与梯度层的界面处;当N=5,2≤P≤3,热应力最大值位于梯度层内;适量增加梯度层厚度Hf和基片厚度Hm有利于减小热应力最大值,此梯度缓冲层在室温到α相钨酸锆陶瓷的相变温度(120℃)区间内,对于各厚度的功能铜层都有良好的保护作用。
The finite element method was used to establish the mathematical model of the Cu / ZrZn functional thin film with mild thermal stress. The effects of the gradient N thin film thickness, the composition distribution index P, the gradient layer thickness Hf, the substrate thickness Hm and the pure copper layer thickness Hc , And the influence of different working environment temperature θ on the thermal stress distribution of the film. Calculated by the thermodynamics shows that: the more the gradient layer, the better the thermal stress relaxation effect. Considering the complexity of the preparation process, the numerical simulation results show that when N≥5, P = 1, the maximum thermal stress can be reduced and the maximum thermal stress appears at the interface between the substrate and the gradient layer. When N = 5, 2≤P≤3, and the maximum thermal stress is located in the gradient layer. Appropriate increase of the thickness of the gradient layer Hf and the substrate thickness Hm is beneficial to reduce the maximum thermal stress. The gradient buffer layer is stable from room temperature to α-phase zirconium tungstate ceramic phase Variable temperature (120 ℃) range, for the thickness of the functional copper layer has a good protective effect.