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温度是影响产品寿命的重要指标。随着平台芯片性能的不断增强和产品体积的不断缩小,散热问题变得越来越严重,这给产品设计带来挑战。本文针对产品设计中同步开关电源电路MOSFET温度过高的问题,运用了Cadence公司Sigrity Power DC仿真软件中的Single-Board/Package E/T Co-Simulation模块对问题进行电热混合仿真,模拟问题现象。通过改进仿真设置中的电源负载结构,使得器件表面温度的仿真结果更贴近实际测试值。并将相同的电源负载结构、材料设置等应用于改善的设计中,验证了改善设计的有效性并比较准确的预测了改善设计中的结果,使器件温度最终达到设计标准。电热协同仿真能有效的预测器件的工作温度,对产品可靠性设计有重要参考价值,对节省开发成本有很大帮助。
Temperature is an important indicator of product life. As the platform chip performance continues to increase and product size continues to shrink, cooling issues become more and more serious, which presents the product design challenges. In this paper, aiming at the problem of over-temperature MOSFET in the synchronous switching power supply circuit in product design, the single-board / package E / T Co-Simulation module in Sigdence Power DC simulation software of Cadence was used to simulate and simulate the problem. By improving the power load structure in the simulation setup, the simulation results of the device surface temperature are closer to the actual test values. And the same power load structure, material settings, etc. applied to the improved design, verify the effectiveness of the design to improve and more accurately predict the results of improving the design, the device temperature eventually reached the design standards. Electrothermal co-simulation can effectively predict the operating temperature of the device, the reliability of the product design has an important reference value, to save development costs are very helpful.