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当微电子器件封装中的热应力足够大时 ,常常会导致封装开裂甚至失效 .热应力主要是在制造过程中由于环境温度变化和封装材料热失配而产生的 .因此 ,对封装设计进行热应力估算和可靠性研究是必不可少的 .采用 ABAQUS有限元计算软件 ,对某型混合集成电路的铜基金属功率外壳 ,建立了功率器件封装的三维计算模型 ,进行了应力和变形分析计算 .计算结果为提高封装结构的可靠性和优化封装设计提出了理论依据
When the thermal stress in the microelectronic device package is large enough, it often leads to cracking or even failure of the package, which is mainly caused by the change of the ambient temperature and the thermal mismatch of the packaging material in the manufacturing process.Therefore, Stress estimation and reliability research are essential.Using ABAQUS finite element software, a three-dimensional computing model of power device package is established for the copper-based metal power housings of a hybrid integrated circuit, and the stress and deformation analysis and calculation are carried out. The calculation results provide the theoretical basis for improving the reliability of the package structure and optimizing the package design