一年以前,一批新的激光系统才刚刚进入集成电路的制造领域。激光在今后的芯片制造中应用前景现在已经明朗化。更进一步的深入应用还有待于半导体厂家去努力。XMR公司说,他们生产的用于硅电路微细加工的准分子激光系统LMMC,在其投产后的第二年底,开始有了转机。但这家公司的另一台系统就不那么幸运,那是一台基于准分子激光辅助掺杂技术,用于大容量存储器芯片的精确的极浅扩散系统。该公司眼下还在寻找一家大公司对它的系统进行投资。 A year ago, a new batch of laser systems was just entering the manufacturing of integrated circuits. Laser application prospects in the future of chip manufacturing has now become clear. Further in-depth application of semiconductor manufacturers still have to work hard. XMR said the LMMC, an excimer laser system for microfabrication of silicon circuits, had its turnaround the end of the second year after it was put into production. But the other system at the company was less fortunate to be an accurate, very shallow diffusion system based on excimer laser-assisted doping for high-capacity memory chips. The company is still looking for a big company to invest in its systems.