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本文针对LTCC毫米波多层前端系统的垂直互连过渡结构进行研究。微带线到带状线的垂直过渡结构广泛应用于LTCC多层前端系统,其性能对于整个射频系统有重要影响。本文利用HFSS三维电磁场仿真软件建立了过渡结构的物理模型,并且完成了实物加工和测试工作。测试结果和仿真结果较为吻合,在0-40GHz频段范围内,微带线到带状线背靠背过渡结构的回波损耗均低于-14dB,插入损耗均优于-0.8dB。上述结果表明,该过渡结构具有良好的宽带传输特性,可以应用于LTCC多层射频前端系统。
In this paper, LTCC millimeter-wave multi-layer front-end system of vertical interconnect transition structure for research. The vertical transition from microstrip to stripline is widely used in LTCC multilayer front-end systems and its performance has a significant impact on the overall RF system. In this paper, the physical model of the transitional structure is established by using HFSS 3D electromagnetic field simulation software, and the physical processing and testing are completed. The test results are in good agreement with the simulation results. The return loss from the microstrip line to the back-to-back transition structure of the stripline is lower than -14dB and the insertion loss is better than -0.8dB in the frequency range of 0-40GHz. The above results show that the transition structure has good broadband transmission characteristics and can be applied to LTCC multi-layer RF front-end system.