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全球半导体制造设备企业中排名第一的美国应用材料公司与排名第三的日本东电电子公司达成经营合并协议。我们发现半导体行业的发展动向:半导体设备业在整体产业环境趋紧的背景下正通过合并求得生存,大尺寸晶圆与微细化技术所带来的新技术革新是促成这一趋势的深层动因,而整合所带来的加成效应则促进了新技术的研发与实现。
US Applied Materials, the # 1 semiconductor manufacturing equipment company in the world, entered into a merger agreement with the third-largest Nihon Denshoku Electronics Co., Ltd. We find trends in the semiconductor industry: the semiconductor equipment industry is merging to survive in the context of a tighter overall industrial environment. New technological innovations brought by large-size wafers and micronization technologies are the underlying drivers of this trend , While the additive effect brought by the integration has promoted the development and realization of new technologies.