论文部分内容阅读
通过HSPICE模拟和理论分析研究了FPGA互连中的阻性短路缺陷行为.结果表明,阻性短路产生了时序故障,小电阻缺陷甚至产生了布尔故障.对于大电阻缺陷,当被测通路进行v to v′转换,且引起短路故障的另一条通路保持v值时,最好检测方式发生.另外,使用静态分析可以很容易检测到小电阻缺陷.在最好检测方式下,评估了电源电压和温度对测试结果的影响.结果表明低电压有助于改善测试,短路材料有正温度系数时,低温测试较好,反之高温测试较好.
The resistance short circuit behavior in FPGA interconnection was studied by HSPICE simulation and theoretical analysis.The results show that the resistive short circuit caused the timing fault and the small resistance defect even produced the Boolean fault.For the large resistance defect, to v ’and the other path causing a short-circuit fault is best to detect v. In addition, small resistance defects can be easily detected using static analysis. In the best detection mode, the supply voltage and Temperature on the test results.The results show that low voltage helps to improve the test, short-circuit materials have a positive temperature coefficient, the low temperature test is better, whereas the high temperature test is better.