实验研究了高功率片状放大器不接地(悬浮状态)时感应电压的变化规律,结果表明:感应电压的大小主要受到金属腔体与氙灯之间的分布电容、放大器充电电压以及氙灯数量的影响;腔体之间不产生直接影响关系。实验研究了放大器在多种接地方式下的感应特性,提出了放大器内外腔电一体化并整体接地的接地方案,并将其成功应用到了神光Ⅱ第9路350mm片状放大器中,从根本上消除了放大器内部电击穿的可能性,并将放大器的感应电压降低到悬浮状态下的18%,提高了片状放大器运行可靠性和安全性,同时有助于改善放大器的紧凑性和洁净度。采用这种接地方案以来,350mm放大器可靠运行400多发次,未出现电击穿或干扰现象。 The experimental results show that the induced voltage is mainly affected by the distributed capacitance between the metal cavity and the xenon lamp, the charging voltage of the amplifier and the number of xenon lamps. There is no direct relationship between cavities. Experimental study of the amplifier in a variety of grounding characteristics of the induction mode, put forward the integration of the amplifier inside and outside the cavity and the overall grounding of the ground solution, and successfully applied to the SG 9  350mm chip amplifier, from the fundamental Eliminates the possibility of electrical breakdown inside the amplifier and reduces the induced voltage of the amplifier to 18% in the floating state, improving the operational reliability and safety of the chip amplifier while helping to improve the compactness and cleanliness of the amplifier degree. With this grounding scheme, the 350mm amplifier operates reliably for more than 400 times without electrical breakdown or interference.