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激光直写技术因其不需要掩模就可以在绝缘基板表面直接制备各种高精度、复杂形状的导电层而受到广泛重视。但是 ,布线速度过低和工艺复杂一直是阻碍该技术工业化应用的瓶颈。提出了一种以导电金属粒子、有机成膜物质构成的复合导电浆料为熔覆物质 ,以有机环氧板为绝缘基板 ,采用CO2 激光加热直接制备线路板的新工艺、新方法。所布导线宽度为 35 0 μm ,布线速率为 2～ 2 0mm/s,所用的激光功率为 0～ 2 0W ,光斑直径约为 10 0μm。系统研究了激光直写导电层的组织结构特征、导线与基板的结合强度以及导线导电率的变化特征。结果表明 ,激光微细熔覆直写布线层与基材结合牢固 ,所布导线的电阻率与导电银颗粒的体积分数及激光功率的大小有关 ,工艺参数与材料配比合适时 ,导线电阻率可以达到 10 -6Ωcm的数量级 ,能够满足工业应用的要求。最后 ,对普通环氧树脂板下激光微细熔覆金属导电浆料直写导线时导线的形成机理和导电机理进行了分析。
Because laser direct writing technology can directly prepare various kinds of conductive layers with high precision and complex shapes on the surface of an insulated substrate because it does not need a mask, it is widely appreciated. However, low wiring speed and complicated process have always been the bottleneck impeding the industrial application of the technology. A new process and a new method of direct preparation of circuit boards by CO2 laser heating are proposed, in which a composite conductive paste composed of conductive metal particles and organic film-forming substances is a cladding material and an organic epoxy board is used as an insulation substrate. The width of the laid wire is 35 0 μm, the wiring speed is 2-20 mm / s, the laser power used is 0-200 W, and the spot diameter is about 100 μm. The characteristics of the structure of the laser direct-write conductive layer, the bonding strength of the wire and the substrate and the conductivity of the wire are systematically studied. The results show that the direct write-wiring layer of the laser cladding layer is strongly bonded with the substrate. The resistivity of the routed wire is related to the volume fraction of the conductive silver particles and the size of the laser power. When the process parameters and the material ratio are appropriate, the wire resistivity can be Up to the order of 10 -6 Ωcm, to meet the requirements of industrial applications. Finally, the formation mechanism and conduction mechanism of the lead wire when the direct-written laser cladding metal conductive paste under the epoxy resin board is written directly are analyzed.