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为了探讨机播密植春玉米田间实际保苗率,以4个玉米品种(CI6502、M752、XY335和XY420)为试验材料,设置5个播种密度,采用随机区组试验设计,研究机播密植条件下,提高春玉米田间保苗率的措施。结果表明:采用John Deer公司1030型指夹式播种机,平均田间保苗率可达到85%~94%;采用国产小型指夹式播种机(2BZF-2吉林康达农机公司),平均田间保苗率可达到79%~88%。为保证出苗率达到计划种植密度,当种植密度低于7万株/hm2时,田间实际播种量应高于计划种植密度8%~10%;当种植密度高于7万株/hm2时,田间实际播种量应高于计划种植密度12%~15%。验证试验时采用国产小型播种机,结果表明当种植密度较低时(<7万株/hm2),田间实际播种量应高于计划种植密度13%~15%;当种植密度较高时(>7万株/hm2),田间实际播种量应高于计划种植密度17%~20%。提出机播密植条件下提高春玉米田间保苗率的措施:精细整地、适时播种、精心播种、适当提高用种量。
In order to investigate the actual seedling protection rate of maize planting and planting dense spring maize field, four planting varieties (CI6502, M752, XY335 and XY420) were used as experimental materials to set up five planting densities. Randomized block design was used to study the effects of seed- Measures to improve seedling protection rate in spring corn field. The results showed that the mean seedling protection rate of 85% ~ 94% could be achieved by using the John Deer 1030 finger-type seeder. The average seedling coverage rate of the field was obtained using a domestic small finger-type seeder (2BZF-2 Jilin Kangda Agricultural Machinery Co., Ltd.) Can reach 79% to 88%. In order to ensure that the emergence rate reaches the planted planting density, when the planting density is less than 70,000 plants / hm2, the actual sowing amount in the field should be higher than the planned planting density by 8% -10%; when the planting density is higher than 70,000 plants / hm2, The actual seeding rate should be higher than the planted planting density of 12% to 15%. The results showed that when the planting density is low (<70,000 / hm2), the actual sowing amount in the field should be higher than the planted planting density by 13% ~ 15%; when the planting density is higher (> 70,000 / hm2), the actual field seeding rate should be higher than the planted planting density of 17% to 20%. Proposed planting sowing conditions to improve the spring corn field seedling conservation measures: fine preparation of land, timely sowing, careful sowing, appropriate to increase the use of seed.