铜代铝制作芯片或将为芯片设计带来一场革命美国国际商用机器公司(IBM)宣布,该公司希望用铜代替铝作为芯片内部导线的材料,以改善芯片的性能。对于电工专家来说,以铜作为导线的想法是理所当然的,因为铜的导电性优于铝。如今,铜导线,特别是当它与一种名为“低介电常数绝缘”的技术相结合时,很可能会给芯片设计带来一场革命。芯片制造与其他许多领域的情况一样,体积至关重要——体积越小,效果越好。在过去的30多年时间里,芯片的“线宽”(即芯片表面元件的最小尺寸以及元件之间的间隔)一直在缩小,而 Copper-based aluminum chips or chip design will bring a revolution United States International Business Machines Corporation (IBM) announced that the company hopes to use copper instead of aluminum as a chip internal wire material to improve the performance of the chip. For electrotechnical experts, the idea of ​​using copper as a conductor is a matter of course because copper is more conductive than aluminum. Nowadays, copper wires, especially when combined with a technology called “low dielectric constant”, are likely to revolutionize chip design. Chip manufacturing As in many other areas, volume is critical - the smaller the size, the better. Over the past 30 years, the “line width” of the chip (ie, the minimum size of the chip surface elements and the spacing between the elements) has been decreasing