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采用ＩＣＰ－ＡＥＳ法研究了基体铅、锡对分析元素的干扰情况，使用了直接背景校正法和干扰因子校正法。测定了焊料中９种杂质元素，并与基体匹配法、化学法进行了对比。
ICP-AES method was used to study the interference of lead and tin on the analytical elements. The direct background correction method and interference factor correction method were used. The 9 kinds of impurity elements in solder were measured and compared with the matrix match method and chemical method.