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采用超声波化学镀覆技术和电镀技术分别对导电陶瓷Ti_3SiC_2颗粒表面和碳纤维表面进行镀铜处理。用粉末冶金法制备了两组成分相同的Ti_3SiC_2-碳纤维-铜-石墨复合材料,其中一组加入的是镀铜Ti_3SiC_2(A组),另一组加入的是不镀铜Ti_3SiC_2(B组),对它们的密度、电阻率、硬度和抗弯强度进行了测试。结果表明:随Ti_3SiC_2含量的增加两组复合材料的密度、导电性、硬度和抗弯强度明显提高,并且加镀铜Ti_3SiC_2的碳纤维-铜-石墨复合材料的性能指标明显优于加不镀铜Ti_3SiC_2的碳纤维-铜-石墨复合材料。
Ultrasonic chemical plating technology and electroplating technology were applied to the surface of conductive ceramic Ti 3 SiC 2 particles and carbon fiber surface copper plating treatment. Two groups of Ti3SiC2-carbon fiber-copper-graphite composites with the same composition were prepared by powder metallurgy. One of them was plated with Ti3SiC2 (group A), the other was uncoated Ti3SiC2 (group B) Their density, resistivity, hardness and flexural strength were tested. The results show that the density, electrical conductivity, hardness and flexural strength of the composites increase obviously with the increase of Ti_3SiC_2 content, and the properties of Cu_3SiC_2 with Cu_3SiC_2 are obviously better than that with uncoated Ti_3SiC_2 Carbon fiber-copper-graphite composite material.