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西门子公司和摩托罗拉公司的合资公司宣布将在300毫米(12英寸)晶片试生产64Mb位DRAM测试芯片。一年以前,当其他的芯片制造商们正在为从今天的200毫米(8英寸)晶片基座向10英寸基座转换的代价而斟酌犹豫的时候,西门子和摩托罗拉开办合资公司并成为制造300毫米晶片试生产线的第一家公司。该工作原型公告的发布起因于英特尔公司打算重启动其300毫米试生产线。据公司和业内消息称,英特尔计划近期宣布将准备配备15亿美元的设备。去年4月份,当英特尔发现300毫米的制造工具尚未完备且对于推进pilot line的总体市
A joint venture between Siemens and Motorola announced that it is piloting a 64-Mbit DRAM test chip on a 300-mm (12-inch) wafer. A year ago, Siemens and Motorola started a joint-venture company when it was considering hesitating to move from today’s 200-mm (8-inch) wafer base to a 10-inch base today, The first company in wafer test production line. The release of the working prototype announcement stems from Intel’s intention to restart its 300mm pilot line. According to the company and industry sources, Intel plans to announce recently that it will be equipped with 1.5 billion US dollars of equipment. Last April, when Intel discovered that the 300mm manufacturing tool was not yet complete and that it was a good idea to push the overall line of the pilot line