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研究了采用大光斑半导体激光进行表面堆焊时,保持其它工艺参数不变,不同的激光功率(900、1 100、1 300、1 500、1 700W)在Q235基体上对Ni60合金粉末单道堆焊层熔深、熔宽、稀释率、显微组织及硬度、耐磨性的影响。研究表明,随着激光功率的增加,堆焊层熔深、熔宽、稀释率、枝晶尺寸均增加,硬度、耐磨性降低。根据激光功率对单道熔覆层性能的影响,选取最佳激光功率参数进行单层多道焊,得到宏观形貌良好的堆焊平面。
Studied the use of large spot semiconductor laser surface surfacing, while maintaining the same process parameters, different laser power (900,1 100,1 300,1 500,1 700 W) on the Q235 matrix Ni60 alloy powder single-channel reactor Welding layer penetration, melting width, dilution rate, microstructure and hardness, wear resistance. The results show that with the increase of laser power, the penetration depth, melting width, dilution rate and dendrite size increase, and the hardness and wear resistance decrease. According to the influence of laser power on the performance of single pass cladding layer, the optimal laser power parameters were selected for single layer and multi-pass welding to obtain a good surfacing surfacing plane.