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1.引言为使高频半导体器件如高频晶体管等适用于微波领域,器件本身的高频化以及组装技术的高频化就显得相当重要。比如器件的截止频率达10千兆赫时,由于封装的引线以及杂散电容就会使得信号未传播到器件上就被截止了,因而不能适用。组装技术的高频化的考虑大致可分为以下两个问题。一是管壳的问题,另一个是器件端子与管壳端子电气连接的键合问题。本报告是关于后一个问题,叙述对于高频化的一些考虑,报告了基
1. INTRODUCTION In order to make high-frequency semiconductor devices such as high-frequency transistors and the like suitable for use in the field of microwaves, it is important to increase the frequency of the device itself and increase the frequency of the assembly technique. For example, when the cut-off frequency of the device reaches 10 gigahertz, it can not be applied because the package leads and stray capacitances will cause the signal to be cut off without propagating to the device. The high frequency of assembly technology considerations can be broadly divided into the following two questions. One is the problem of the package, and the other is the bonding issue where the device terminals are electrically connected to the package terminals. This report is about the latter issue, describing some of the considerations for high frequency and reporting the basics