论文部分内容阅读
研究了Cu－20Cr－20Ni和Cu－20Cr－40Ni两种合金在800℃，0．1MPa纯氧气中的氧化行为．结果表明，Cu—20Cr－20Ni合金的氧化动力学遵循近似的抛物线规律、而Cu－20Cr－40Ni合金的瞬时抛物线速率常数随时间而降低，两种合金生成组织复杂的氧化膜，外层是一连续的CuO层一内层是Cu2O，NiO和Cr2O3组成的混合区，其中Cu2O基体上分布着少量未氧化完全的Cr颗粒，这种颗粒的存在是动力学因素所致对于Cu－20Cr－20Ni合金，氧化膜最里面没有形成连续的Cr2O3膜，氧化较为严重，而Cu—20Cr－40Ni合金，氧化膜最里面形成了一连续的Cr2O3膜，抑制了合金的进一步氧化，因此，Cu－20Cr－40Ni氧化膜的厚度较Cu－20Cr－20Ni薄得多，氧化膜的成分随着与合金／氧化膜界面距离的改变而显著变化这种显微组织特征较纯金属或二元合金复杂得多
The oxidation behavior of Cu-20Cr-20Ni and Cu-20Cr-40Ni alloys in pure oxygen at 800 ℃ and 0.1MPa was studied. The results show that the oxidation kinetics of Cu-20Cr-20Ni alloy follow an approximate parabolic law, while the instantaneous parabolic rate constant of Cu-20Cr-40Ni alloy decreases with time. The two alloys produce complex oxide films with a The inner layer of continuous CuO layer is a mixed zone composed of Cu2O, NiO and Cr2O3, in which a small amount of non-oxidized complete Cr particles are distributed on the Cu2O matrix. The existence of such particles is due to kinetic factors. For Cu-20Cr-20Ni alloy , The oxide film is the most inside did not form a continuous Cr2O3 film, the oxidation is more serious, and Cu-20Cr-40Ni alloy, the oxide film formed the most inside a continuous Cr2O3 film, inhibited the further oxidation of the alloy, therefore, Cu-20Cr-40Ni The thickness of the oxide film is much thinner than that of the Cu-20Cr-20Ni, and the composition of the oxide film changes significantly with the distance from the alloy / oxide film interface. This microstructure is much more complex than pure metals or binary alloys