用电子背散射衍射(EBSD)和X射线衍射(XRD)研究了Cu薄膜的微观结构和织构。实验结果表明,在单晶硅表面通过热蒸发制备的Cu薄膜平均晶粒尺寸小于200nm,并且存在着大量的孪晶。增加薄膜厚度和200℃退火可使晶粒尺寸有所长大,Cu薄膜中存在较强的{111}纤维织构,增加薄膜厚度{111}纤维织构减弱,200℃退火后{111}纤维织构增强。 The microstructure and texture of Cu films were investigated by electron backscatter diffraction (XRD) and X-ray diffraction (XRD). The experimental results show that the average grain size of Cu thin film prepared by thermal evaporation on the surface of monocrystalline silicon is less than 200 nm, and there are a lot of twins. Increasing the film thickness and annealing at 200 ℃ increased the grain size, and {111} fiber texture existed in Cu film. The texture of {111} fiber increased and the {111} fiber after annealing at 200 ℃ Texture enhancement.