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美国Irvine传感器公司和Northrup Grumman公司将花掉15个月的时间,为以Irvine的专利三维芯片组为基础而设计的新一代集成红外传感器建立生产规约,具体目标是一套规则,可以通过半导体生产工艺将红外传感器信号处理芯片组与该公司的计算机记忆芯片合在一起.Irvine的部门经理David Shostak认为:真正的革新在于:在三年之内,Irvine及其转让者将能够采用红外焦平面阵列,并将之集成到三维
US Irvine Sensors and Northrup Grumman to Spend 15 Months Establishing Manufacturing Protocol for Next-Generation Integrated Infrared Sensors Based on Irvine’s patented 3-D chipset targeting a set of rules that can be produced through semiconductors Process combines an infrared sensor signal processing chipset with the company’s computer memory chip, and David Shostak, division manager at Irvine, believes the real innovation is that within three years Irvine and its transferors will be able to use infrared focal plane arrays , And integrate it into 3D