The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed.By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification,filtering and gain.In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits (MMIC) operating chip,the 3D vertical interconnection micro-assembly technology is used.By stacking solder balls on the printed circuit board (PCB),the technology decreases the volume of the original transceiver to a miniaturized module.The module has a good electromagnetic compatibility through special structure designs.This module has the characteristics of miniaturization,low power consumption and high density,which is suitable for popularization in practical application.