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采用有限元分析方法,研究SHS/QP技术制备叠层材料过程中试样的温度分布和变化,为工艺参数的选择和试样界面结构分析提供参考。有限元计算表明SHS反应层厚度增加时,Fe基片界面处温度升高,Fe以液相存在的时间延长。采用有限元分析方法计算叠层材料残余热应力,叠层材料中TiB2+Fe金属陶瓷层与Fe基片的界面结合处径向边缘出现轴向应力和剪切应力的奇异点,导致在这个区域出现应力集中。
The finite element analysis method was used to study the temperature distribution and variation of samples during the process of SHS / QP fabrication. The results provide references for the selection of process parameters and the analysis of interface structure of samples. Finite element analysis shows that when the thickness of SHS reaction layer increases, the temperature at the interface of Fe substrate increases and the duration of Fe existing in liquid phase prolongs. Finite element analysis method is used to calculate the residual thermal stress of the laminated materials. The radial edges of the interface between the TiB2 + Fe cermet layer and the Fe substrate in the laminated material appear singular points of axial stress and shear stress, Stress concentration occurs.