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探讨了固溶、时效热处理工艺对一种新型铜基电接触材料微观组织与结构的影响。结果表明,合金在固溶过程中形成Cu-Ni单相固溶体,在时效过程中产生Ni3Ti合金相,从而导致合金显微组织与结构的变化,提高材料的综合性能,获得一种高强、高导的电接触材料,满足实际生产的需求。
The effects of solution heat treatment and aging treatment on the microstructure and structure of a novel copper-based electrical contact material were discussed. The results show that the alloy forms the Cu-Ni single phase solid solution in the solution process and produces the Ni3Ti alloy phase during the aging process, which leads to the change of the microstructure and structure of the alloy, improves the comprehensive properties of the alloy, Of the electrical contact material to meet the actual production needs.