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在合成酚醛树脂的过程中引入有机硅预聚物和硼酸,制得硼硅酚醛树脂,并在此基础上加入正硅酸乙酯,原位水解生成SiO 2,进一步改性了硼硅酚醛树脂。分别考查了有机硅预聚物、硼酸和正硅酸乙酯加入量对改性酚醛树脂粘接强度的影响。通过IR考查了改性树脂的结构,硼氧键和硅氧键成功地引入到酚醛树脂中。还通过DSC和不同条件下粘接强度的测试考查了改性树脂的固化性能,确定了其固化工艺。空气气氛中的热重分析则表明改性酚醛树脂初始分解温度为475℃,1 000℃残炭率为21%,耐热性明显优于普通酚醛树脂。
In the process of synthesizing phenolic resin, silicone prepolymer and boric acid are introduced to obtain borosilicone phenolic resin, and based on this, ethyl orthosilicate is added to hydrolyze SiO 2 in situ to further modify borosilicone phenolic resin . The effects of the amount of organic silicon prepolymer, boric acid and tetraethyl orthosilicate on the bond strength of the modified phenolic resin were investigated. The structure of the modified resin was investigated by IR. The boron-oxygen bond and silicon-oxygen bond were successfully introduced into the phenolic resin. The curing properties of the modified resins were also examined by DSC and the bonding strength tests under different conditions to determine the curing process. Thermogravimetric analysis in the atmosphere showed that the initial decomposition temperature of the modified phenolic resin was 475 ℃ and the char yield at 1 000 ℃ was 21%. The heat resistance was obviously better than that of the common phenolic resin.