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提出了在印刷电路板(PCB)上实现全嵌入光互联(FEOI)的方法,采用软成型技术(微转移成型)制作了具有45°微反射镜的聚合物波导,这种技术可以用PDMS弹性模板把特征尺寸大于几nm的图案转移到衬底上。在波长为850nm时,测量的多模波导传播损耗为0.16dB/cm,45°镀Ag微反射镜的耦合效率测得为92%。具有高品质45°微反射镜、低损耗和热稳定好的铸模聚合物波导,为高速全嵌入板级光互联提供了一个低成本的解决方案。
A method of realizing fully embedded optical interconnection (FEOI) on a printed circuit board (PCB) is proposed. A polymer waveguide with a 45 ° micromirror is fabricated by using a soft forming technique (Micro Transfer Molding). This technique can be implemented using PDMS elasticity The template transfers patterns with feature sizes greater than a few nm onto the substrate. The propagation loss of the multimode waveguide measured at 850 nm was 0.16 dB / cm and the coupling efficiency of the 45 ° Ag-plated micromirror was measured at 92%. High quality 45 ° micromirrors, low loss, and thermally stable molded polymer waveguides provide a low cost solution for high speed fully embedded board optical interconnects.