论文部分内容阅读
印制板装配元器件时,因为特殊需要经常用阻焊剂,文章列举了对阻焊剂的要求,并对阻焊干膜工艺、阻焊剂漏印工艺作了叙述。
Printed board assembly components, because of the special needs of regular use of solder mask, the article lists the requirements of the solder resist, and the dry film solder mask technology, solder mask printing process described.