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皇家飞利浦电子集团成员之一,飞利浦半导体今天宣布,推出业界首个采用0.18μm CMOS工艺制造的32位智能卡计算平台——HiPerSmart智能卡IC。 HiPerSmart平台采用MIPS公司的Smart MIPS结构,可为服务银行、电子商务和3G应用的高容量多应用卡提供增强的存储器和安全特性。此外,它还特殊适用于UMTS集成电路卡(UICC),包括USIM和RUIM应用。 通过将先进的0.18μm工艺技术与32位SmartMIPS内核相结合,飞利浦半导体可帮助智能卡厂商以可靠、经济的方法制造32位产品,满足先进、高容量应用的需要。
Philips Semiconductors, a member of Royal Philips Electronics Group, today announced the release of HiPerSmart smart card IC, the industry’s first 32-bit smart card computing platform manufactured in a 0.18μm CMOS process. The HiPerSmart platform uses MIPS Smart MIPS architecture to provide enhanced memory and security features for high capacity multi-application cards serving banking, e-commerce and 3G applications. In addition, it is particularly suitable for UMTS integrated circuit card (UICC), including USIM and RUIM applications. By combining advanced 0.18μm process technology with the 32-bit SmartMIPS core, Philips Semiconductors enables smart card vendors to manufacture 32-bit products in a reliable and cost-effective way to meet the needs of advanced, high-volume applications.