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本文通过热分析仪（ＤＳＣ）对４，４＇—二氨基二苯甲烷（ＤＤＭ）、间苯二胺（ｍ—ＰＤＡ）和３，３’—二氯—４，４’—二氨基二苯甲烷（ＭＯＣＡ）按７：１０：３组成共混物的等速升温熔融曲线作了研究，发现它具有最低共熔温度。研究了该低熔共混物固化Ｅ—５１环氧树脂的最佳配比。采用ＪＳＲ固化仪和ＤＳＣ对该低共熔混合物固化Ｅ—５１环氧的过程分别作了恒温和等速升温的观察，得到了二者的反应活化能。最后用ＴＭＡ和ＴＧ法对固化物的耐热性进行了评估。
4,4’-Diaminodiphenylmethane (DDM), m-phenylenediamine (m-PDA) and 3,3’-dichloro-4,4’-diaminodiphenyl Methane (MOCA) was studied on a constant temperature melting curve of a 7: 10: 3 blend and found to have the lowest eutectic temperature. The best ratio of E-51 epoxy resin cured by this low-melt blend was studied. The curing reaction of E-51 epoxy with eutectic mixture was observed by constant temperature and constant temperature respectively with JSR curing system and DSC, and the activation energy of both was obtained. Finally, the heat resistance of the cured product was evaluated by TMA and TG methods.