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夏普将上市最大光脉冲功率为162mW的红外高能全息激光头,主要用于以24倍速写入的9.5mm厚光驱。 通过独自开发的小型高散热封装技术及高精度芯片焊接(Die Bonding)技术,夏普在该产品中实现了24倍速写入中“业界最薄”的3.0mm封装。同时还内置了分光镜及衍射功能。支持采样/保持(Sample/Hold)方式。
Sharp will debut the largest optical pulse power of 162mW infrared high energy holographic laser head, mainly used to write at 24x speed 9.5mm thick optical drive. Through the development of its own small high-heat-shrink packaging technology and high-precision Die Bonding technology, Sharp has implemented the industry’s thinnest 3.0mm package in a 24x speed write. Also built-in spectroscope and diffraction capabilities. Support sample / hold (Sample / Hold) mode.