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近年来固体照明技术发展迅速,尤其在白光LED照明领域。但白光LED在长期使用中,受到高温、光照或外来污染物的影响,容易出现明显的变色现象,降低LED的出光效率或导致色温漂移。变色可能发生在LED的各种封装材料当中,不同种类封装材料的变色机理并不一样。本文结合本实验室和其他相关实验室的研究,分别对反光杯、固晶胶、荧光粉及封装硅胶4种封装材料的变色模式和机理进行讨论分析。同时还设计了支架镀银层的变色机理验证实验,实验结果表明与理论相符合。
In recent years, solid-state lighting technology has developed rapidly, especially in the field of white LED lighting. However, white LED in the long-term use, subject to high temperature, light or external contaminants, prone to significant discoloration, reduce the LED light efficiency or lead to color temperature drift. Discoloration may occur in a variety of LED packaging materials, different types of packaging materials, color change mechanism is not the same. Based on the research of this laboratory and other related laboratories, this paper discusses the discoloration mode and mechanism of four kinds of packaging materials, such as reflector cup, solid crystal adhesive, phosphor and encapsulated silica. At the same time, the mechanism of the discoloration mechanism verification of the silver plating layer was also designed. The experimental results show that it is in accordance with the theory.