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用显微结构方法研究了Cu与液态Sn的相互作用;作出了浸沾时间与Cu溶解扩散的关系图。温度升高至350℃时金属间化合物Cu_6Sn_5的生长有突跃,以羽毛状迅速生长并突破沾Sn层。研究了抑制金属间化合物生长的各种方法。根据上述研究,详细讨论了meniscograph方法所得润湿曲线的物理意义。
The microstructure was used to study the interaction between Cu and liquid Sn. The relationship between the immersion time and the dissolution and diffusion of Cu was also given. When the temperature is increased to 350 ℃, the intermetallic compound Cu_6Sn_5 has a sudden growth and grows featherily and breaks through the Sn layer. Various methods of inhibiting the growth of intermetallic compounds have been studied. Based on the above studies, the physical meanings of the wetting curves obtained by the meniscograph method are discussed in detail.