采用放电等离子体烧结(SPS)工艺制备(30～50)％Cu/Invar(质量分数)双金属基复合材料.通过设计正交实验方案,系统研究Cu含量、压制压力及烧结温度对复合材料显微结构、力学性能和热性能的影响.结果表明,随着Cu含量由30％增加至50％(质量分数),Cu基体逐渐转变为连续网络分布,复合材料致密度、热导率及热膨胀系数增大,但抗拉强度降低.提高烧结温度,Cu/Invar界面扩散加剧,导致复合材料的热导率降低,抗拉强度增大.压力对复合材料热性能的影响较为复杂.在700℃,60 MPa下制备的50％Cu/Invar(质量分数)复合材料具有最高的热导率,为90.7 W/(m·K),优于以往报道的大多数Cu/Invar复合材料.“,”An orthogonal experiment scheme was designed to investigate the effects of the Cu content, compaction pressure, and sintering temperature on the microstructures and mechanical and thermal properties of (30-50)wt.％Cu/ Invar bi-metal matrix composites fabricated via spark plasma sintering (SPS). The results indicated that as the Cu content increased from 30 to 50 wt.％, a continuous Cu network gradually appeared, and the density, thermal conductivity (TC) and coefficient of thermal expansion of the composites noticeably increased, but the tensile strength decreased. The increase in the sintering temperature promoted the Cu/Invar interface diffusion, leading to a reduction in the TC but an enhancement in the tensile strength of the composites. The compaction pressure comprehensively affected the thermal properties of the composites. The 50wt.％Cu/Invar composite sintered at 700 ℃ and 60 MPa had the highest TC (90.7 W/(m·K)), which was significantly higher than the TCs obtained for most of the previously reported Cu/Invar composites.