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以硫脲作为电位调整剂,以甲烷磺酸锡为主盐的酸性溶液作为镀液,采用浸镀法在铜基材上制备了锡镀层。采用场发射扫描电子显微术(FESEM)和X射线衍射(XRD)表征锡镀层的组织结构,数码相机微距照片表征镀层的宏观形貌。研究表明,该镀液体系浸镀锡可以获得光滑而致密的浸锡层,无枝晶形成。该镀层主要相结构为体心四方的白锡。镀层的形成可分为锡晶粒的剧烈瞬间形核、平面层状生长和镀层致密化排列3个阶段。
Thiourea was used as potential regulator and tin methanesulfonate as acid salt solution was used as plating solution. The tin coating was prepared on copper substrate by dipping method. The structure of the tin coating was characterized by field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD). The digital camera macro photographs characterize the macro morphology of the coating. The results show that the tin plating solution can be smooth and dense immersion tin layer, no dendrite formation. The main phase of the coating structure for the body of the Quartet of white tin. The formation of coating can be divided into dramatic instantaneous nucleation of tin nuclei, flat layered growth and coating densification arranged in three stages.