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无氰镀铜有焦磷酸盐、硫酸盐、乙二胺、柠檬酸盐、酒石酸盐及草酸盐等体系,但直接在钢铁零件上镀铜结合力不好。有的工艺须经过预浸或预镀等处理,少数工艺虽然能直接镀在钢铁件上,但往往稳定性差或成本昂贵而受到一定限制。七八年以来我们推广应用了HEDP镀铜工艺,生产实践证明此工艺成分简单、稳定,工艺规范宽,操作方便,能直接在钢铁上镀铜和铝件上冲镀铜,结合力良好,镀层细致光亮。
Cyanide-free copper plating with pyrophosphate, sulfate, ethylenediamine, citrate, tartrate and oxalate systems, but directly on the steel parts of copper bonding is not good. Some processes have to go through prepreg or pre-plating and other treatment, although a few processes can be directly plated on steel parts, but often poor stability or high cost and subject to certain restrictions. Since 1978 we promote the use of HEDP copper plating process, production practice has proved that the composition of the process is simple, stable, wide process specifications, easy to operate, can be directly on the copper and aluminum plating on the copper plating, good bonding, coating Delicate light.