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以BNi2为中间层,在不同的焊接参数下对TLP扩散焊IC10单晶与GH3039高温合金,以及IC10/BNi2/GH3039接头进行了微观组织及力学性能的分析。结果表明:焊接参数对接头界面组织的影响较为复杂,焊接温度的升高并不一定能够促进接头实现完全等温凝固,而保温时间的延长有助于接头实现完全等温凝固;1200℃/2h参数下的的接头常温拉伸强度达到736MPa,900℃高温拉伸强度达到220MPa,综合力学性能最好。
BNi2 as the intermediate layer, the TLP diffusion welding IC10 single crystal and GH3039 superalloy, and IC10 / BNi2 / GH3039 joints under different welding parameters were analyzed microstructure and mechanical properties. The results show that the influence of welding parameters on the microstructure of the joint is complicated. The increase of welding temperature does not necessarily promote the complete isothermal solidification of the joint, and the prolongation of the holding time can help the joint achieve complete isothermal solidification. Under 1200 ℃ / 2h Of the joint tensile strength at room temperature to 736MPa, 900 ℃ high temperature tensile strength reached 220MPa, the best overall mechanical properties.