无芯载板封装技术,因为其Z向高度需求低,在微型移动设备方面非常具有吸引力。为了充分表述无芯封装技术的高品质和多功能性,需要研究这项技术的几个特定方面,以了解其优缺点。设计制造了一款典型的无芯板BGA封装的样板,并表征了其电源特性和IO信号完整性。通过采用标准有芯BGA封装和无芯BGA封装,对比两种封装的性能。 Coreless board packaging technology, because of its low Z-height requirements, is extremely attractive for miniature mobile devices. In order to fully demonstrate the high quality and versatility of coreless packaging technology, several specific aspects of this technology need to be explored to understand its advantages and disadvantages. Design and manufacture of a typical sample of the coreless BGA package, and characterizes the power characteristics and IO signal integrity. Compare the performance of the two packages by using standard cored BGA and coreless BGA packages.