聚酰亚胺是一种新型耐高温钝化材料,涂敷在硅表面上形成的薄膜带有负电荷,可以削弱硅表面电势,此外聚酰亚胺还具有物理和化学性能稳定,耐辐射、电绝缘性好、韧件强、工艺简单、成本低,适合于批量生产等特点.本文将对用于硅台面和平面技术中的聚酰亚胺表面钝化工艺效果进行分析和介绍,以确定聚酰亚胺钝化与器件的可靠性和稳定性的关系. Polyimide is a new type of high temperature resistant passivation material. The thin film formed on the silicon surface is negatively charged to weaken the silicon surface potential. In addition, polyimide has the advantages of stable physical and chemical properties, radiation resistance, Electrical insulation, strong toughness, simple process, low cost, suitable for mass production and other characteristics.This paper will be used for the silicon tabletop and planar technology in the polyimide surface passivation process analysis and introduction to determine Relationship between polyimide passivation and device reliability and stability.